Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 csm besi datacon 2200 evo advanced 1000 db160738c9.jpg from besi.
Plating unit rationalized 2014: US die sorting operations rationalized.Warning: Missing argument 3 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 Besi offers flip chip systems for mass production as well as for the high-end sector, covering a wide range of flip chip processes. datacon 2200evo plus 2016 01.jpg from besiView Photo.
Headcount and product line restructuring 2012 : 8.3 million cost savings. DATACON 2200 EVO Vintage 2012 ( Available November 2019 in Europe) In R&D Facility Like new - Hardly Used Comes with many extra spares The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. 1 BESI Semi Packaging Tech Seminar June 18th, Vila do Conde - PortugalĢ Agenda Company Overview Equipment portfolio Market Process and package Roadmap 2ģ Revenue ( millions) Gross Margin (%) Company History Founded in Die Attach Acquisitions % 43.8% % Restructuring Dragon I complete: 6 million cost savings 2008 Dragon II complete: 15 million cost savings 2010 Plan: 7.0 million cost savings.